Taiwan's TSMC is likely to be the second chip-making company after Intel to receive the <a target=_blank href= ...

The Biden Administration has announced a new R&D facility that will focus on improving microship lithography technology.

Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.

In October 2019, SK Hynix developed 1Znm 16GB (Gigabits) DDR4 (Double Data Rate 4) DRAM. As 16 GB is the industry’s largest ...

A research team led by Xuesong Mei and Jianlei Cui from Xi'an Jiaotong University has made significant progress in the field of nanotechnology. They have successfully achieved the direct writing of ...

Onto Innovation (ONTO – Research Report), the Technology sector company, was revisited by a Wall Street analyst today. Analyst Charles ...

A semiconductor research center in Albany, New York, has been selected to receive up to $825 million in federal funding ...

Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) ...

Recently, a research team led by Xuesong Mei and Jianlei Cui from Xi’an Jiaotong University has made significant progress in ...

There have been many attempts to create monochromatic metallic materials, but few materials change luster color in response ...

Enhancing EUV Lithography Materials Production in Japan and South KoreaTOKYO - October 29, 2024 — FUJIFILM Corporation announced the sales of ...