Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT.

This paper demonstrates the capability of EMI-207, a metal-complex conductive ink that sets the standard for particle-free conductive coatings, combined with widely adopted spray application for ...

TSMC revealed at the OIP Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, featuring a 9x reticle size and supporting 12 HBM4 stacks, revolutionizing AI ...

INEMI hosted a webinar spotlighting Glass Substrates for Advanced Packaging, showcasing Intel's pioneering work. Dr. Dilan Seneviratne and Dr. Gang Duan of Intel detailed the company's strategic focus ...

GaN mosfet provides significantly lower resistance and low capacitance than silicon mosfet which makes GaN mosfet considered as alternative power devices to replace silicon mosfet, and by the adoption ...

The semiconductor industry's "shift left" revolutionizes design by prioritizing systems-focused methodologies. This approach fosters collaboration, adaptability & innovation, addressing complex ...

China's booming AI industry faces a severe talent shortage, with AI-related roles dominating "new economy" job openings, a Maimai report reveals. Despite high salaries—up to $686,000—competition ...

The 2024 semiconductor industry saw AI-driven growth, with revenue boosts for Micron, Nvidia & TSMC. However, automotive demand slumped & oversupply issues linger. China's equipment demand sustained ...

Qualcomm secured a legal victory against Arm Holdings, with jurors finding no breach of a chip technology license tied to Qualcomm's $1.4 billion Nuvia acquisition. However, Arm plans to seek a ...

TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT ...