With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry.

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Infineon has unveiled the world’s thinnest silicon power wafers, with a thickness of 20 micrometers and a diameter of 300 millimeters. The company said the newly produced wafers are half as thick as ...

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Semiconductor industry sources recently told the Taiwan-based Commercial Times that TSMC plans to charge over $30,000 for wafers built on its upcoming 2nm N2 process node. The move would continue ...

Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand ...

The big picture: Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant ...

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WASHINGTON, Oct 15 (Reuters) - Wolfspeed (WOLF.N), opens new tab is set to receive $750 million in government grants for its new North Carolina silicon carbide wafer manufacturing plant facility ...

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon ...