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Semiconductor Engineering
6 天
Chip Industry Week In Review
Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...
Semiconductor Engineering
2 天
Research Bits: Dec. 24
Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...
Semiconductor Engineering
7 天
Strain, Stress In Advanced Packages Drives New Design Approaches
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...
Semiconductor Engineering
16 天
Semiconductor Test Faces Technology Shifts In The AI Era
The surge in data-rich applications shows no signs of slowing down, fueling significant evolution within the global semiconductor industry. This insatiable demand for data necessitates a comprehensive ...
Semiconductor Engineering
9 天
Baby Steps Toward 3D DRAM
3D DRAM can mean two things, one of which is already in production. “The most popular use case for 3D DRAM is HBM ...
Semiconductor Engineering
9 天
Navigating Increased Complexity In Advanced Packaging
Implementing inline inspection and adaptive process control systems, supported by machine learning algorithms, can provide ...
Semiconductor Engineering
9 天
Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second ...
Semiconductor Engineering
8 天
RISC-V Profiles Help Conformance
More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...
Semiconductor Engineering
7 天
Achieving Successful Multi-Die Signoff
Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...
Semiconductor Engineering
9 天
EU Chips Act: A Game Changer For The Digital Economy
New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and ...
Semiconductor Engineering
9 天
Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade ...
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
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