面板級扇出型封裝技術。 將低翹曲多層RDL、大尺寸高均勻銅電鍍等技術導入面板廠，將3.5代舊產線轉型為半導體扇出型封裝產線，以面板產線進行IC封裝，得利於其方形面積，相較於晶圓的圓形有更高的利用率，達到95%。 特色與創新 因為面板生產線的特性，讓 ...

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