For hydrogen fuel cells to become a practical alternative to internal-combustion engines, their durability must improve. Despite growing global interest in zero-emissions vehicles, hydrogen-fuel-cell ...

STMicroelectronics backs Innoscience’s IPO, boosting GaN semiconductor market potential. Despite Innoscience and its partners not releasing any official statements, according to this document, ...

SPICE offers a wide range of possibilities to explore a circuit’s behavior, modifying other quantities such as voltage, temperature, current, resistance and many others. In SPICE, it is common to ...

Renewable energy such as wind and solar are heavily seen as the most promising means to harness readily available energy that can be converted to electricity. One such solution is using a 1500 V ...

Amongst the ultrawide-bandgap semiconductor materials, the beta phase of gallium oxide is perhaps the most promising. The 3 × 3-mm device cathode was bonded onto a 0.5-mm-thick ...

2024 has been a crucial year for the power electronics sector in terms of development, preparing for radical changes in 2025 and beyond. 2024 has been a crucial year for the power electronics sector ...

The increasing interest in battery EVs has accelerated the deployment of WBG semiconductors for improving efficency and attaining longer drive ranges. The increasing interest in battery electric ...

We are almost at the end of 2024, with time to examine and reflect on the past year, as well as look ahead to 2025 and the advances it will bring. I am pleased to share two of my articles on general ...

The lateral High Electron Mobility Transistor (HEMT) is the most widely used GaN device. Gallium Nitride (GaN) based power semiconductors have many advantages in power conversion. They are seeing ...

Replacing fuel-burning vehicles with electric vehicles is one of the best alternatives to reduce CO2 emissions. Electric mobility is a crucial driver of the energy revolution, and it is predicted to ...

QPT, a Cambridge-based power electronics firm, has developed a breakthrough in semiconductor packaging technology that promises to enhance heat dissipation and reliability in high-power applications ...